Marhynchus set of 27 universal BGA stencils for chip reballing

Marhynchus – set of 27 universal BGA stencils

The BGA stencil set is designed for reballing, that is replacing the solder balls in integrated circuits mounted in BGA packages. The perforated meshes let you apply tin balls evenly to the chip, which is useful when repairing laptops, desktop computers and consumer electronics.

How the stencils work

A BGA stencil is placed on the chip so that the holes line up with the solder pads, then tin balls are poured on and the whole thing is heated. The stencils in this set are heated directly, and the manufacturer states that they do not easily deform under heat. They can also be reshaped with a hot air blower. The stencil area is chosen to match the chip area, which limits wasted solder balls.

Uses

• reballing chips in laptops and desktop computers,
• repairing processors and chips in an electronics repair shop,
• hobby work soldering BGA chips.

Specifications

The compact BGA stencil set is a convenient addition to a soldering station and consumer electronics repair tools.